1. Write the incorrect statement. A Schottky diode ?

is a bipolar device

has fast recovery time

has no depletion layer

has metal semiconductor

Answer: has fast recovery time

Explanation:


2. In forward region of its characteristics, a diode appears as ?

an OFF switch

an ON switch

an high resistor

a capacitor

Answer: an ON switch

Explanation:


3. The de current gain (D) of BJT is 50. Assuming that the emitter injection efficiency is 0.995, the base transport factor is ?

0.995

0.990

0.980

0.985

Answer: 0.985

Explanation:


4. Compared to the bipolar junction transistor, a JFET: 1. has a larger gain bandwidth production. 2 is less noisy. 3. has less input resistance. 4, has current flow due to only majority carriers ?

2 and 4 are correct

1,2,3 and 4 are correct

3 and 4 are correct

1 and 2 are correct

Answer: 2 and 4 are correct

Explanation:


5. In a JFET, increase in applied external bias to the gate causes ?

decrease in channel resistance

increase in drain current

decrease in drain current to achieve pinch-off voltage

decrease in size of depletion regions

Answer: decrease in drain current to achieve pinch-off voltage

Explanation:


6. The effective channel length of a MOSFET in saturation decreases with increase in ?

drain voltage

gate voltage

body voltage

source voltage

Answer: drain voltage

Explanation:


7. The conduction loss versus device current characteristic of a power MOSFET is best approximated by ?

an exponentially decaying function

a parabola

a rectangular hyperbola

a straight line

Answer: a parabola

Explanation:


8. A CMOS amplifier when compared to an N-channel MOSFET. has the advantage of ?

higher current gain

higher voltage gain

lower current drain from the power supply, thereby less dissipation

higher cut-off frequency

Answer: lower current drain from the power supply, thereby less dissipation

Explanation:


9. In an integrated circuit, the SiO, layer provides ?

conducting path

electrical connection to external circuit

physical strength

isolation

Answer: isolation

Explanation:


10. Thin gate oxide in a CMOS process is preferably grown using ?

dry oxidation

ion implantation

epitaxial deposition

wet oxidation

Answer: dry oxidation

Explanation: